What management said
·ASML expects to scale EUV Low NA output to at least 80 units in 2027, a 33%+ increase from 2026, conditional on customer demand.
↑ASML targets at least 60 Low NA EUV system output for 2026, defining the near-term supply ceiling for EUV lithography equipment.
↑ASML reports that memory customers are fully sold out for 2026 with supply constraints extending beyond 2026, indicating severe DRAM/HBM allocation tightness.
↑ASML's CEO states that semiconductor supply will not meet demand for the foreseeable future, creating constraints across AI, mobile, and PC end markets.
↑ASML reports that DRAM and logic customers are publicly validating High NA EUV's ability to reduce EUV mask count from 3 to 1, with customers beginning to test on real products, indicating progression toward qualification.
↓ASML increased NXE:3800E throughput by ~5% (220→230 wph), effectively adding EUV capacity without new tool shipments through productivity gains on the installed base.
↑Deep UV immersion demand has reversed from expected decline to growth, indicating broader lithography tightness beyond EUV as customers expand capacity across multiple nodes.
↑ASML raised and narrowed its 2026 revenue guidance to €36-40 billion, reflecting stronger-than-expected demand across EUV and non-EUV business lines.